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Customized Tin Plating Services

Customized Tin Plating Services
Customized Tin Plating Services
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Service Code : CTP S-07

With an aim to render quality oriented solutions to clients, we are engaged in rendering Customized Tin Plating Services. We provide weather proof coating on terminals, bus bars, switches and several other electrical components. We have a team of experienced professionals who use advanced methods and plating machinery and commit to complete the task at prescribed time frame. Moreover, our clients can avail the provided Customized Tin Plating Services at economic prices from us.

Key points:

  • Use of advanced mechanism for flawless coating
  • Highly concerned in providing quality oriented solutions to clients
  • Provide cost-effective solutions

Customized Tin Plating

Customized Tin plating is used extensively on many different  types of metals, both ferrous and nonferrous. Tin is A gray-white, soft, and ductile metal that is not easily oxidized in air. Electrodeposited  tin has good conductivity and corrosion resistance  while enhancing solder ability of substrates that are not otherwise easily soldered to.

Tin is generally considered non-toxic  and non-carcinogenic and as such its use is  generally approved for food contact applications.

Tin plating is provided in two general types of deposits: bright tin and matte tin. Both can  be obtained from an alkaline or acidic bath and both are electrolytically applied. The acidic chemistries are most common today.
Bright tin

  • Properties
  • More esthetic appeal
  • Increased lubricity
  • Corrosion protection
  • Electrical enhancements to the substrate


Electrical  contact  applications  such as: bus  bars, Terminals, and switching components that don’t  require soldering.

Matte tin


  • Solderable
  • Non-reflective
  • Corrosion  protection
  • Electrical  enhancements  to the substrate


Electrical contact applications such as: bus bars, terminals, and switching components where soldering is Required For substrates alloyed with zinc it is generally recommended to apply A diffusion barrier or nickel or copper to Prevent zinc migration into the tin deposit. Tin deposits can have the potential to form tin “whiskers” on the Surface of the deposit. For applications where tin whiskers could negatively impact the function of the Product, tin-lead plating is used.

Tin is not good for low temperature applications as it changes structure and loses adhesion when exposed to Temperature below 40° F.

The AMBIKA INDUSTRIES  plates tin to the following specifications among others:

ASTM B 545
Sae-ams 2408

Trade Information
  • Packaging Details
  • According to products
  • Main Domestic Market
  • All India


NS-EN ISO 9001 :2008/ISO 9001:2008
Plot No. V-48, 5th Main, Peenya Second Stage, Industrial Estate, Bengaluru - 560058, Karnataka, India
Phone :+918068092896
Mr. Manjunath (Proprietor )
Mobile :+918068092896
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